Solid Press-Fit Technology

Press-fit technology is a favorable alternative to conventional soldering on printed circuit board applications

With press-fit technology, a connection is established between the plated-through sleeve of a circuit board and the contact pin of, for example, a plug connector. This creates a powerful, gas-tight electrical connection.

The electrical transfer resistance plays a crucial role in the quality of this connection. The higher the electrical transfer resistance is, the worse the connection is on the basis that a resistance generates a voltage drop and, by extension, heat, which is primarily a problem with the transfer of higher electric currents.

Minimum connection of a pin compared to the real press-fit zone

In order to limit electrical transfer resistance, the electric current of one of the entry faces into the connection zone must have at least comparable exit faces (exit faces ≥ entry faces) – irrespective the correct selection of materials.

The fulfilment of this condition ensures that there is no bottleneck. To ensure that this condition is fulfilled with a typical press-fit connection and a functional electrical connection is established, the connection angle of a corner of the contact pin must typically measure at least 3°. As the image clearly illustrates, the real press-fit connection possesses many reserves. This explains why the press-fit connection functions so well.

Consequently, solid press-fit technology is most notably suitable for high-current applications and for the use under adverse environmental conditions. The reasons for that are:

  • Excellent electrical characteristics
  • Lower impact of the PCB‘s PTH barrel on the press-fit zone
  • Excellent mechanical properties of solid press-fit zone