Microvia Filling

Image Usual Wording according IPC 2226
Microvia Filling Microvia Filling

Outer layers: Resin filling only permissible when the
microvias are not positioned in solder pads.
Inner layers: On demand.
Microvia Filled & Capped Microvia Filled & Capped

Microvia Filled & Capped Innenlage
Microvia on inner layer

Microvia Filled & Capped Außenlage
Microvia on outer layer

Microvia Filled & Capped Stacked
Stacked Microvia
Microvia Copper Filling Microvia Copper Filling

Microvia Copper Filling Innenlage
Microvia on inner layer

Microvia Copper Filling Außenlage
Microvia on outer layer

Microvia Copper Filling Stacked
Stacked Microvia