Wire bonding is a technology that uses micro-welding microwires to create an electrical connection between chip contact surfaces (pads) and the housing of substrate contact surfaces.

The goal of wire bonding is to create a good electrical contact, along with good, firm mechanical connection of the bond wires in order to avoid short circuiting.

Wire bonding offers many advantages:

  • Flexibility in terms of chip, housing and substrate geometry  
  • The connection and its dependability are easy to test  
  • Connection repair option  
  • Option of different pad metallizations on the chip substrate  
  • Reduction in manufacturing costs  
  • Saves space  
  • Simple handling of complex circuits