Wire bonding is a technology that uses micro-welding microwires to create an electrical connection between chip contact surfaces (pads) and the housing of substrate contact surfaces.
The goal of wire bonding is to create a good electrical contact, along with good, firm mechanical connection of the bond wires in order to avoid short circuiting.
Wire bonding offers many advantages:
- Flexibility in terms of chip, housing and substrate geometry
- The connection and its dependability are easy to test
- Connection repair option
- Option of different pad metallizations on the chip substrate
- Reduction in manufacturing costs
- Saves space
- Simple handling of complex circuits