Tecreport: Embedded Active Devices

Würth Elektronik mass produces its first VHDI (very high density interconnection) applications. Laser-produced deep milling grooves in circuit boards are now the latest possibility, following microvia technology, to connect and embed components with hitherto unachieved precision on the deeper layers of a multilayer board. One of the crucial differences to previously favored classic solution approaches is the layout directly on the contact layer. With the innovative combination of structured laser cavities and state-of-the-art flip-chip bonding procedures, embedded active devices can now be positioned easily and economically on the interior layers of HDI multilayers. .....

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