Multilayer PCBs

Your direct benefit: Manufacture according to standard parameters

  • Time and cost savings through reduced design and work preparation workload
  • Yield optimisation on both sides
  • Clear and unambiguous communication
  • Stable transition from prototype to series production

Manufacturing process

In the following video we will show you the process of manufacturing a multilayer PCB.

Some of our standards
Properties Values
max. number of layers 20
max. circuit board size 570 x 500 mm
circuit board thickness max. 2.4 mm*
min. 0.6 mm
copper cladding (base copper) 18 µm, 35 µm, 70 µm, 105 µm
material FR4 (TG 135, TG 150, TG 170)
surface finishes HAL,   HAL lead-free, electroless nickel/ immersion gold,
immersion tin,  
min. tool diameter 0.25 mm
min. conductor track width and distance 100/100 µm (standard)
75 µm (min)
aspect ratio (hole diameter : circuit board thickness) 1 : 8
additional printing
  • legend printing
  • via fill print
  • peelable resist
  * greater thickness upon request
Standardised documentation
Documentation Standards
Inspection certificate According to DIN EN 10204
Factory inspection certificate
  • According to DIN EN 10204
  • Inspection based on IPC
Initial sample inspection “standard”
  • According to DIN EN 10204
  • Inspection based on IPC
Initial sample inspection “thorough” (customized)
  • According to DIN EN 10204
  • Inspection based on IPC
Overview of surfaces
  Lead-free Layer thickness Shelf life Comments
Hot Air Leveling (HAL) No (HAL SnPb) 1... 40 μm 12 months
  • no longer permissible since 2006 (exception: see guidelines)
Hot Air Leveling (HAL) Yes 1... 40 μm 12 months
  • high process temperature (265-280 °C)
  • increased Cu removal, dependent on layout
Chemical nickel-gold cNiAu Yes 4 ... 7 μm Ni
0,075…±0,025 μm Au
12 months
  • low process-temperature (approx. 90 °C)
  • smooth coating
  • connection made to Ni
Chemical tin cSn Yes 0,8 ... 1,1 μm 6 months
  • low process temperature (approx. 70 °C)
  • smooth coating
  • growth in the intermetallic phase between Cu and Sn
  • layer thickness > 1 μm required for multiple soldering
  • rapid processing in the assembly process