Multilayer PCBs

Your direct benefit: Manufacture according to standard parameters

  • Time and cost savings through reduced design and work preparation workload
  • Yield optimisation on both sides
  • Clear and unambiguous communication
  • Stable transition from prototype to series production

Manufacturing process

In the following video we will show you the process of manufacturing a multilayer PCB.

Some of our product parameters
Properties
max. number of layers 20 20
max. circuit board size 570 x 500 mm 1150 x 550 mm
circuit board thickness max. 2.4 mm*
min. 0.5 mm
max. 4.5 mm
min. 0.5 mm
copper cladding (base copper)   18 µm, 35 µm, 70 µm, 105 µm 18 µm - 210 µm
material FR4 (TG 135, TG 150, TG 170) FR4 (TG 135, TG 150, TG 170), RF
surface finishes HAL, HAL lead-free, electroless nickel/immersion gold, immersion tin, immersion Ag, gold finger, ENEPIG   HAL, HAL lead-free, electroless nickel/immersion gold, immersion tin, immersion Ag, OSP, gold finger, ENEPIG
min. conductor track width and distance 100/100 µm (standard)
75 µm (min)
100/100 µm (standard)
75 µm (min) (18 µm base copper) 
aspect ratio (hole diameter : circuit board thickness) 1 : 8 1 : 12
additional printing
  • legend printing
  • via fill print
  • peelable resist
  • polymer print
  • legend printing
  • via fill print
  • peelable resist
  • polymer print
  * greater thickness upon request   
Standardised documentation
Documentation
Inspection certificate
  • according to DIN EN 10204
  • customer requirement  
  • WE general specifications
  • IPC
Factory inspection certificate
  • according to DIN EN 10204  
  • inspection based on IPC
  • customer requirement
  • WE general specifications
  • IPC
Initial sample inspection “standard”
  • according to DIN EN 10204
  • inspection based on IPC
  • customer requirement
  • WE general specifications
  • IPC
Initial sample inspection “thorough” (customized)
  • according to DIN EN 10204
  • inspection based on IPC
  • customer requirement
  • WE general specifications
  • IPC
Overview of surfaces
 
Lead-free

Layer thickness

Layer thickness

Shelf life

Comments
Hot Air Leveling
(HAL)
No (HAL SnPb)   1 ... 40 μm 1 ... 40 μm 12 months 
  • no longer permissible since 2006 
    (exception: see guidelines)
Hot Air Leveling (HAL) Yes 1 ... 40 μm 1 ... 40 μm 12 months
  • high process temperature (265-280 °C)
  • increased Cu removal, dependent on layout
Chemical nickel-gold cNiAu Yes 4 ... 7 μm Ni
0.075 … ± 0.025 μm Au  
min. 3 μm Ni
min. 0.05 μm Au
12 months
  • low process-temperature (approx. 90 °C)
  • smooth coating
  • connection made to Ni
Chemical tin cSn Yes 0,8 ... 1,1 μm ≥ 1.0 μm 6 months
  • low process temperature (approx. 70 °C)
  • smooth coating
  • growth in the intermetallic phase between Cu and Sn
  • layer thickness > 1 μm required for multiple soldering
  • rapid processing in the assembly process