Informations actuelles sur le topic Microvia

No.1 (01/05): Development of drilling costs! (251 ko)

No.2 (02/05): 0,75 mm BGA-what does that mean for the pcb? (287 ko)

No.3 (03/05): Microvia-boards and their nomenclature (251 ko)

No.4 (04/05): Impedance control and microvias – an antagonism? (280 ko)

No.5 (05/05): Costs and complexity (179 ko)

No.6 (06/05): Ampacity of microvias (207 ko)

No.7 (07/05): Microvia test-board for lead-free soldering (776 ko)

No.8 (08/05): Microvia and microvia have not always the same meaning (232 ko)

No.9 (09/05): 6-layer microvia – multilayer stack-ups (standard) (148 ko)

No.10 (10/05): 500 µm Pitch QFP and its difficulties with solder mask (217 ko)

No.11 / No. 12 (12/05): Assortment of material or being spoilt for choice?! (209 ko)

No.13 (01/06): 650 µm BGA-Pitch Design rules (275 ko)

No.14 (02/06): Laser drilling from layer 1 to layer 3 - in one drill run (888 ko)

No.15 (04/06): Electroless Ni/Au - the all-round surface finish (259 ko)

No.16 (05/06): Immersion Silver - first class at Würth Elektronik (296 ko)

No.17 (07/06): Immersion tin - microvias meeting press-fit (249 ko)

No.18 (08/06): The latest HDI microvia design rules available (222 ko)

No.19 (10/06): Less is more - new base material for HDI Boards (212 ko)

No.20 (12/06): Heat dissipation supported by Microvias (831 ko)

No.21 (01/07): 400 µm Pitch QFP – Design Rules (175 ko)