|
Wording according IPC 4761 description and options |
Image | Usual wording | |
|---|---|---|---|
Plugged Via
|
Type III-a sealing with a non-conductive material on one side, which partially enters the via |
|
Plugged Via / Via Plugging on one side Via fill print Via closing print Via closing |
| Plugged Via |
Type III-b sealing with a non-conductive material on both sides, which partially enters the via |
|
Plugged Via / Via Plugging on both sides |
| Plugged & Covered Via |
Type IV-a sealing with a non-conductive material on one side, which partially enters the via and additional covered up with soldermask Type IV-b sealing with a non-conductive material on both sides, which partially enters the via and additional covered up with soldermask |
 
|
Plugged & Covered Via / Via Plugging & Covering on one side Via fill print before soldermask Via closing print before soldermask Via closing before soldermask Plugged & Covered Via / Via Plugging & Covering on both sides |
|
= recommended by WE
|
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Initial situation A „opened” vias:
- Possible solder run-off into vias (solder bridges)
- In-circuit test at assembly
Solution:
The most cost effective way to close the vias is by means of a plugging process. Relatively large space requirements (clearance to neighbouring solder lands) and additional coating thickness above the soldermask must be taken into consideration.
Plugged Via
Type III-a
sealing with a
non-conductive material
on one side, which partially
enters the via
Plugged Via
Type III-b
sealing with a
non-conductive
material on both sides, which
partially enters the via
