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Macnica ODYSSEY-MAX10 | Demoboard ODYSSEY-MAX10-KIT

Odyssey MAX 10 FPGA and BLE Sensor Kit

Details

Topologie Aufwärtswandler
Eingangsspannung 3.3 V
IC-Revision 2.2

Beschreibung

The Mpression Odyssey MAX 10 FPGA and BLE Sensor Kit is an evaluation board ideal for doing Internet of Things (IoT) proof-of-concept development. The board is designed to allow users to evaluate the use of and write software for the BCM20737S BLE module, Max10 FPGA, EnergyMicro Giant Gecko microcontroller, and the sensors included in the kit for use in their own end products.This kit encompass everything users need to connect wirelessly using Bluetooth® Low Energy (BLE), collect information from the environment and even add custom designs using programmable logic. The Odyssey MAX 10 FPGA and BLE Sensor Kit contains a BLE sensor board, an FPGA expansionboard and a battery board. The BLE sensor board has a Bluetooth SMART device, a microcontroller and various sensors. The sensors include UV and ambient light, pulse rate and blood oximetry, temperature and humidity as well as acceleration. It also features a physical interface to either the battery board or the FPGA expansion board. The FPGA expansion board includes an FPGA for programmable logic, a microphone, LEDs, switches, push-buttons and expansion capabilities to an Arduino Nano. The battery board allows the user to power the BLE sensor board off a coin cell battery for true wireless applications. An I2C expansion port and a J-Link interface to program the microcontroller are also integrated on the battery boardThe kit is designed to interact with a Smartphone via the BLE link. This communications link is used to exercise the sensors and other interfaces by means of a complex firmware infrastructure. Depending on individual needs, users can easily use the existing framework to implement a designor users can modify the firmware to achieve unique design goals.It is the object of this document to both introduce the first time user to the details of connecting to and using the Odyssey kit as well as expose some details of the underling framework for more experienced engineers that need to build upon the existing infrastructure.

Typische Anwendungen

  • smartphone application
  • humidity sensor and UV
  • Battery board with a coin cell holder

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Downloads Produktserie λDom typ.
(nm)
Farbe λPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie 50% typ.
(°)
Poles Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Reihen Gender IR
(mA)
Verpackung Muster
150060VS75000
STE ALT EAG LTS PSP CAD IGS WL-SMCW SMT Mono-color Chip LED Waterclear 570 Hellgrün 572 40 2 AlInGaP 140 Tape and Reel
7427927218
STE ALT EAG CAD LTS PSP IGS CAD WE-CBF SMT-Ferrit 180 260 500 MHz 900 0.3 Wide Band 900
416131160804
IGE STE 3D ALT EAG CAD WS-DISV Small Compact SMT Flat Actuator with Top Tape 1.27 mm 4 Tape and Reel
61301021121
IGE STE 3D ALT EAG CAD WR-PHD 2.54 mm THT Dual Pin Header Board Stacker Dual Pin Header 3000 Beutel
61301511121
IGE STE 3D ALT EAG CAD WR-PHD 2.54 mm THT Pin Header Gerade Single Pin Header 3000 Beutel
Muster
Artikel Nr. Daten­blatt Downloads Produktserie λDom typ.
(nm)
Farbe λPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie 50% typ.
(°)
Poles Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Reihen Gender IR
(mA)
Verpackung Muster