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IC-Hersteller NXP

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NXP S32V234 | Demoboard SBC-S32V234

i.MX 8 – Arm® Cortex®-A53

Details

Topologie Sonstige Topologie
IC-Revision 3

Beschreibung

ARM® Cortex®-A53, 64-bit CPU– Up to 1000 MHz Quad ARM Cortex-A53– 32 KB/32 KB I-/D- L1 Cache– NEON MPE co-processor– Dual precision FPU– 2 clusters with 2 CPUs and 256 KB L2 cache each– Memory Management Unit– GIC Interrupt Controller– ECC/parity error support for its memories– Generic timers– Fault encapsulation by hardware for redundantexecuted application software on multiple corecluster• ARM Cortex-M4, 32-bit CPU– Up to 133 MHz– 16 KB/16 KB I-/D- L1 Cache– 32+32 KB tightly coupled memory (TCM)– ECC/parity support for its memories• Clocks– Phase Locked Loops (PLLs)– 1 external crystal oscillator (FXOSC)– 1 FIRC oscillator• System protection and power management features– Flexible run modes to consume low power based onapplication needs– Peripheral clock enable register can disable clocks tounused modules, thereby reducing currents– Power gating of unused A53 cores and GPU– Low and high voltage warning and detect– Hardware CRC module to support fast cyclicredundancy checks (CRC)– 120-bit unique chip identifier– Hardware watchdog– eDMA controller with 32 channels (withDMAMUX)– Extended Resource Domain Controller Memory interfaces– 32-bit DRAM Controller with support for LPDDR2/DDR3/DDR3L - Data rate of up to 1066 MT/s at 533 MHz clockfrequency with ECC (SEC-DED-TED) triple error detection support for subregion– QuadSPI supporting Execute-In-Place (XIP)– Boot flash fault detection and correction using two-dimensional parity.– Triple fault detection and single fault correction scheme for external DDR-RAM including address/page fault detection.• Video input interfaces, Image processing, graphics processing, display– Display Control Unit (2D-ACE) with 24-bit RGB, GPU frame buffer decoding– GPU GC3000 with frame buffer compression– 2x VIU (Video interface unit) for camera input– 2x MIPICSI2 with four lanes for camera input (support 1080 pixel @ 30 fps)– Image signal processor (ISP), supporting 2x1 or 1x2 megapixel @ 30 fps and 4x2 megapixel for subset of functions(exposure control, gamma correction)– 2x APEX2-CL Image cognition processor. APEX-642CL comprises two Array Processing Unit (APU) coresconfigurable as single SIMD engine with 64 16-bit Computational Units (CU), or configurable as two core MIMDengines with 32 16-bit CUs each.– CUs are comprised of four Functional Units: 16-bit Multiplier, Load Store Unit, ALU, and Shifter– JPEG video decoder (8/12-bit)– H.264 video decoder (8/10/12-bit), High-intra and constrained baseline formats– H.264 video encode (8/10/12-bit), High-intra only– Fast DMA for data transfers between DRAM and System RAM with CRC• Human-Machine Interface (HMI)– GPIO pins with interrupt support, DMA request capability, digital glitch filter– Configurable slew rate and drive strength on all output pins• System RAM– 4 MB On-Chip System RAM with ECC

Eigenschaften

ARM® Cortex®-A53, 64-bit CPU– Up to 1000 MHz Quad ARM Cortex-A53– 32 KB/32 KB I-/D- L1 Cache– NEON MPE co-processor– Dual precision FPU– 2 clusters with 2 CPUs and 256 KB L2 cache each– Memory Management Unit– GIC Interrupt Controller– ECC/parity error support for its memories– Generic timers– Fault encapsulation by hardware for redundantexecuted application software on multiple corecluster- ARM Cortex-M4, 32-bit CPU– Up to 133 MHz– 16 KB/16 KB I-/D- L1 Cache– 32+32 KB tightly coupled memory (TCM)– ECC/parity support for its memories- Clocks– Phase Locked Loops (PLLs)– 1 external crystal oscillator (FXOSC)– 1 FIRC oscillator- System protection and power management features– Flexible run modes to consume low power based onapplication needs– Peripheral clock enable register can disable clocks tounused modules, thereby reducing currents– Power gating of unused A53 cores and GPU– Low and high voltage warning and detect– Hardware CRC module to support fast cyclicredundancy checks (CRC)– 120-bit unique chip identifier– Hardware watchdog– eDMA controller with 32 channels (withDMAMUX)– Extended Resource Domain Controller

Memory interfaces– 32-bit DRAM Controller with support for LPDDR2/DDR3/DDR3L - Data rate of up to 1066 MT/s at 533 MHz clockfrequency with ECC (SEC-DED-TED) triple error detection support for subregion– QuadSPI supporting Execute-In-Place (XIP)– Boot flash fault detection and correction using two-dimensional parity.– Triple fault detection and single fault correction scheme for external DDR-RAM including address/page fault detection.- Video input interfaces, Image processing, graphics processing, display– Display Control Unit (2D-ACE) with 24-bit RGB, GPU frame buffer decoding– GPU GC3000 with frame buffer compression– 2x VIU (Video interface unit) for camera input– 2x MIPICSI2 with four lanes for camera input (support 1080 pixel @ 30 fps)– Image signal processor (ISP), supporting 2x1 or 1x2 megapixel @ 30 fps and 4x2 megapixel for subset of functions(exposure control, gamma correction)– 2x APEX2-CL Image cognition processor. APEX-642CL comprises two Array Processing Unit (APU) coresconfigurable as single SIMD engine with 64 16-bit Computational Units (CU), or configurable as two core MIMDengines with 32 16-bit CUs each.– CUs are comprised of four Functional Units: 16-bit Multiplier, Load Store Unit, ALU, and Shifter– JPEG video decoder (8/12-bit)– H.264 video decoder (8/10/12-bit), High-intra and constrained baseline formats– H.264 video encode (8/10/12-bit), High-intra only– Fast DMA for data transfers between DRAM and System RAM with CRC- Human-Machine Interface (HMI)– GPIO pins with interrupt support, DMA request capability, digital glitch filter– Configurable slew rate and drive strength on all output pins- System RAM– 4 MB On-Chip System RAM with ECC

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Downloads Produktserie PCB/Kabel/Panel Modularity Wire Section Interface typ Gender Pins Montageart IR 1
(A)
Arbeitsspannung
(V (AC))
Verpackung P
(mm)
Kontaktwiderstand
(mΩ)
Tol. R L
(mm)
H
(mm)
Stranded Wire Section (AWG) Betätigungskraft
(g)
Actuator-Farbe ISAT
(A)
RDC typ.
(mΩ)
fres
(MHz)
Bauform Version Poles Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Wicklungstyp L
(µH)
IR
(A)
LS
(nH)
VR
(V)
VT
(V (AC))
fc
(GHz)
Anwendung Windungsanzahl Muster
679304124022
IGE STE 3D ALT EAG CAD WR-WTB 1.50 mm SMT Male Vertical Shrouded Header PCB Männlich 4 SMT 1 50 Tape and Reel with Cap 1.5 20 max. 9 Vertikal 1
679306124022
IGE STE 3D ALT EAG CAD WR-WTB 1.50 mm SMT Male Vertical Shrouded Header PCB Männlich 6 SMT 1 50 Tape and Reel with Cap 1.5 20 max. 12 Vertikal 1
691214110002
STE 3D ALT EAG IGS CAD WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular PCB Ja 24 to 16 (AWG) 0.205 to 1.31 (mm²) 2 300 Karton 3.5 7.05 24 to 16 (AWG) Horizontal 10 Rising Cage Clamp
742792651
STE ALT EAG CAD LTS PSP IGS CAD SPA WE-CBF SMT-Ferrit SMT 1 1.6 0.8 0603 SMT 600 800 200 MHz 1000 0.2 High Current 1 1
744233670
STE ALT EAG CAD LTS PSP IGS CAD SPA WE-CNSW HF Stromkompensierter SMT Line Filter 4 SMT 2 1.2 0805 SMT 67 0.24 bifiliar 0.092 0.32 50 125 6.5 USB 3.0 2
744227
STE ALT EAG CAD LTS PSP IGS CAD WE-SL2 Stromkompensierter SMT Line Filter 4 SMT 9.2 5 SMT 5500 0.16 bifilar 51 1 85 80 500 CAN 2
744771001
IGS STP ALT EAG CAD LTS PSP SPE CAD WE-PD SMT-Speicherdrossel 2 SMT 12 6 12.5 4 60 1260 Standard 0.006 1.5 10.5 4.5
629105150521
IGE STE 3D ALT EAG CAD Type B with Pegs, High Current at Pin 1 & Pin 5 Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current Type B Receptacle 5 SMT 3 30 Tape and Reel 30 max. Horizontal 3 Micro USB 2.0
694106106102
STE 3D ALT EAG IGS CAD WR-DC DC Power Jack Right Angled SMT Ø 6.4 with 4 soldering pads & pegs SMT 5 24 Tape and Reel 50 max. Right Angled 5
416131160802
IGE STE 3D ALT EAG CAD WS-DISV Small Compact SMT Flat Actuator with Top Tape 1.27 mm 2 0.025 Tape and Reel 1.27 3.71 500 Weiß 2 24
431256038716
STE ALT EAG CAD IGS WS-TATU THT Tact Switch 6x6 mm Right Angled Type with ground terminal Lose 100 max. 3.85 160 Schwarz 0.05 12
Muster
Artikel Nr. Daten­blatt Downloads Produktserie PCB/Kabel/Panel Modularity Wire Section Interface typ Gender Pins Montageart IR 1
(A)
Arbeitsspannung
(V (AC))
Verpackung P
(mm)
Kontaktwiderstand
(mΩ)
Tol. R L
(mm)
H
(mm)
Stranded Wire Section (AWG) Betätigungskraft
(g)
Actuator-Farbe ISAT
(A)
RDC typ.
(mΩ)
fres
(MHz)
Bauform Version Poles Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Wicklungstyp L
(µH)
IR
(A)
LS
(nH)
VR
(V)
VT
(V (AC))
fc
(GHz)
Anwendung Windungsanzahl Muster