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NXP i.MX-RT1050 | Demoboard MIMXRT1050-EVK

MIMXRT1050-EVK: i.MX RT1050 Evaluation Kit

Details

Topologie Sonstige Topologie

Beschreibung

The i.MX RT1050 EVK is a 4-layer through-hole USB-powered PCB. At its heart lies the i.MX RT1050 crossover MCU, featuring NXP’s advanced implementation of the Arm® Cortex®-M7 core. This core operates at speeds up to 600 MHz to provide high CPU performance and great real-time response.Support for FreeRTOS™ available within the MCUXpresso SDK.The i.MX RT1050 EVK board is now supported by Arm® Mbed™ OS and Zephyr™ OS, both open source embedded operating systems for developing the Internet of Things.

Eigenschaften

Memory

256 Mb SDRAM memory512 Mb Hyper Flash64 Mb QSPI FlashFootprint for QSPI FlashTF socket for SD card

Display and Audio

Parallel LCD connectorCamera connectorAudio codec4-pole audio headphone jackExternal speaker connectionMicrophoneS/PDIF connector

Connectivity

Micro USB host and OTG connectorsEthernet (10/100T) connectorCAN transceiversArduino® interface

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Downloads Produktserie Anwendung PCB/Kabel/Panel Modularity Wire Section IR
(A)
Interface typ Gender Pins Montageart IR 1
(A)
Arbeitsspannung
(V (AC))
Verpackung λDom typ.
(nm)
Farbe λPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie 50% typ.
(°)
C Tol. C VR
(V (DC))
Bauform Betriebstemperatur DF
(%)
RISO Keramiktyp L
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Technische Artikelnummer Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Muster
629105150521
IGE STE 3D ALT EAG CAD Type B with Pegs, High Current at Pin 1 & Pin 5 Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current Micro USB 2.0 3 Type B Receptacle 5 SMT 3 30 Tape and Reel -40 °C up to +85 °C 1000  MΩ Horizontal
691102710002
IGE STE 3D ALT EAG CAD WR-TBL Series 102 - 5.00 mm Horiz. Entry Modular Pressure Clamp PCB Ja 22 to 14 (AWG) 0.326 to 2.08 (mm²) 17.5 2 250 Karton -40 °C up to +105 °C 10 Horizontal
693061010911
IGE STE 3D ALT EAG CAD WR-CRD SD Card Connector Push & Push with Card Detection 9 pins SD 0.5 Socket 9 SMT 100 Tape and Reel 1000  MΩ Push & Push
742792651
STE ALT EAG CAD LTS PSP IGS CAD SPA WE-CBF SMT-Ferrit 1 SMT 1 0603 -55 °C up to +125 °C 1.6 0.8 0.8 0.3 600 800 200 MHz 1000 0.2 High Current
150060RS75000
STE ALT EAG LTS PSP CAD IGS WL-SMCW SMT Mono-color Chip LED Waterclear SMT Tape and Reel 625 Rot 630 250 2 AlInGaP 140 0603 -40 °C up to +85 °C 1.6 0.8 0.7
150060BS75000
STE ALT EAG LTS PSP CAD IGS WL-SMCW SMT Mono-color Chip LED Waterclear SMT Tape and Reel 470 Blau 465 145 3.2 InGaN 140 0603 -40 °C up to +85 °C 1.6 0.8 0.7
885012105013
STE ALT EAG CAD LTS PSP CAD WCAP-CSGP MLCCs 10 V(DC) 2.2  µF ±20% 10 0402 -55 °C up to +85 °C 15 0.02  GΩ X5R Klasse II 1 0.5 0.5 0.25 X5R0402225M010DFCT10000
885012105018
STE ALT EAG CAD LTS PSP CAD WCAP-CSGP MLCCs 25 V(DC) 100  nF ±20% 25 0402 10 X5R Klasse II 1 0.5 0.5 X5R0402104M025DFCT10000
Muster
Artikel Nr. Daten­blatt Downloads Produktserie Anwendung PCB/Kabel/Panel Modularity Wire Section IR
(A)
Interface typ Gender Pins Montageart IR 1
(A)
Arbeitsspannung
(V (AC))
Verpackung λDom typ.
(nm)
Farbe λPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie 50% typ.
(°)
C Tol. C VR
(V (DC))
Bauform Betriebstemperatur DF
(%)
RISO Keramiktyp L
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Technische Artikelnummer Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung Zmax IR 2
(mA)
RDC max.
(Ω)
Typ Muster