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MagI³C-VDMM Variable Step Down MicroModule EXTENDED

 SizeL
(mm)
W
(mm)
H
(mm)
Type
LGA-6EP 2.5 2.5 1.2 Overmolded
EXT. LGA-6EP 3.2 2.5 1.6 Open frame

Characteristics

  • Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22

LGA-6EP

  • Very low profile micropackage
  • Ideal for space constrained applications
  • 3 solder cycles supported

Applications

  • Point-of-Load DC/DC applications from 5 V or 3.3 V rail
  • Replacement for linear regulators
  • Interface and microcontroller supply
  • DSP and FPGA power supply auxiliary voltages
  • Portable instruments
  • Battery powered equipment

Products

All
LGA-6EP
LGA-6EP
Order Code Data­sheet Simu­lation DownloadsVin
(V)
Vout
(V)
Iout
(A)
VersionL
(mm)
W
(mm)
H
(mm)
Evaluation Board Samples
171960501SPEC
4 files 2.7 - 5.5 0.6 - 5.5 0.6 Mode Select 3.2 2.5 1.6178960501
171010502SPEC
4 files 2.5 - 5.5 0.8 - 5.5 1 Mode Select 3.2 2.5 1.6178010502
171010550SPEC
4 files 2.5 - 5.5 0.8 - 5.5 1.2 Mode Select 2.5 2.5 1.2178010550
NEW171010501SPEC
5 files 2.5 - 5.5 0.8 - 5.5 1 Power Good 3.2 2.5 1.6178010501
Order Code Data­sheet Simu­lation
171960501SPEC
171010502SPEC
171010550SPEC
NEW171010501SPEC
Samples
Order Code Data­sheet Simu­lation DownloadsVin
(V)
Vout
(V)
Iout
(A)
VersionL
(mm)
W
(mm)
H
(mm)
Evaluation Board Samples