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MagI³C-VDMM Variable Step Down MicroModule

SizeL
(mm)
W
(mm)
H
(mm)
Type
LGA-6EP 2.5 2.5 1.2 Overmolded
LGA-6EP 3.2 2.5 1.6 Open frame

Characteristics

  • Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22

LGA-6EP

  • Very low profile micropackage
  • Ideal for space constrained applications
  • 3 solder cycles supported

Applications

  • Point-of-Load DC/DC applications from 5 V or 3.3 V rail
  • Replacement for linear regulators
  • Interface and microcontroller supply
  • DSP and FPGA power supply auxiliary voltages
  • Portable instruments
  • Battery powered equipment

Products

All
LGA-6EP
LGA-6EP
Order Code Data­sheet Simu­lation DownloadsVIN
(V)
VOUT
(V)
IOUT
(A)
VersionL
(mm)
W
(mm)
H
(mm)
Evaluation Board Samples
171010502SPEC
4 files 2.5 - 5.5 0.8 - 5.5 1 Mode Select 3.2 2.5 1.6178010502
171010550SPEC
4 files 2.5 - 5.5 0.8 - 5.5 1.2 Mode Select 2.5 2.5 1.2178010550
MagI³C Power FeatherWing
171010501SPEC
5 files 2.5 - 5.5 0.8 - 5.5 1 Power Good 3.2 2.5 1.6178010501
171960501SPEC
4 files 2.7 - 5.5 0.6 - 5.5 0.6 Mode Select 3.2 2.5 1.6178960501
Order Code Data­sheet Simu­lation
171010502SPEC
171010550SPEC
171010501SPEC
171960501SPEC
Samples
Order Code Data­sheet Simu­lation DownloadsVIN
(V)
VOUT
(V)
IOUT
(A)
VersionL
(mm)
W
(mm)
H
(mm)
Evaluation Board Samples

Videos

Würth Elektronik Webinar: MicroModule design-in made easy - Tips and tricks

Videos

Würth Elektronik Webinar: Thermal simulation for MagI³C Power Modules using REDEXPERT

Videos

Würth Elektronik Webinar: MicroModules - DC/DC Step-Down Converters f. Space-Constr. Applications