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3D Electronics Forum

Date: October 07, 2020

Location: Virtual conference


Lecture: "From Additive Manufactured Solder Resist for Printed Circuit Boards to Functional 3D-Surfaces" by Jürgen Wolf

Time: 07.10.2020 at 3:40 p.m.

Language: English

More about the content!

In the near future, the conventional way of applying solder resist in purely subtractive processes for printed circuit boards will be replaced by the technology of a digital, functional 3D surface applied in fully additive technology. This presentation shows the approach for the gradual digitalization of printed circuit board production and its processes.

An example of this is the new process of digital additive technology for solder resists, which makes it possible to implement customer wishes and special technological requirements. Up so far, this process is the first and only technology in the industry to offer the possibility of applying several layers of a dielectric directly, partially defined, specifically designed and with high precision. This enables an previously unseen degree of freedom in three-dimensional design.

On the other hand, the quality of soldering can be improved: instead of coating the entire surface with solder resist (including drill holes) and removing it at the desired locations (pads, vias, etc.), material is now only applied at the required locations in the layout. This eliminates organic impurities, as soldermask is only applied where it is needed.

Overall, this presentation shows a revolutionary technology with the potential for a new, digital and three-dimensional technology level for printed circuit boards.

Short biography Jürgen Wolf

Jürgen Wolf (m) studied at the University of Freiburg. After graduation in 2004, he worked at the Institute of Microsystem Technologies (IMTEK) in Freiburg/Germany as scientific assistant before he got involved with the work on reliability of MEMS-based inertial sensors for the Corporate Research of Robert Bosch GmbH/Germany in 2005. Beginning 2008 he started working as project engineer for the department “Research and Development – Circuit Board Technologies CBT” of Würth Elektronik GmbH & Co. KG/Germany and was announced “Assistant Manager Research and Development CBT” in 2012. Since 2015, Jürgen Wolf is the head of the product management "Embedding Technology", which deals with the embedding of components into printed circuit boards.