Proof of Reliability of PCBs

Reliability of PCBs (PDF)

Reliability Proof of PCBs

Reliability Proof by Interconnect Stress Test (IST)

Introduction

We would like to invite you to an introduction to the application of a modern test procedure for bare boards, the Interconnect Stress Test (IST). The webinar is of interest to developers, quality managers, purchasing and management. We have many years of experience with this method and will provide you with interesting insights in the webinar “Reliability Proof by Interconnect Stress Test”.

Without confusing you with too much physics and statistics, we will talk about these topics:

  • Fields of application of the IST
  • Avoidance of downtime costs, proof of reliability
  • Securing new technologies through statistical evaluation of the measurement data
  • Test procedure from planning to result
  • Opportunities for rapid and targeted design optimization

Reliability Proof by Interconnect Stress Test - Introduction (PDF)

Deepening

After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST). We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.

The following topics are discussed in detail in the webinar:

  • Failure modes and their causes
  • Evaluation and presentation of the results of reliability proof
  • Possibilities for optimisation
  • Factors influencing the reliability of PCBs

Reliability Proof by Interconnect Stress Test - Deepening (PDF)